Mentor Graphics Corporation (NASDAQ:MENT) announced FloTHERM 3D computational fluid dynamics (CFD) software for electronics cooling applications. The patent-pending technology provides Bottleneck (Bn) and Shortcut (SC) fields so that you can identify where and why heat flow congestion occurs in the electronic design. It also identifies thermal shortcuts to help resolve design problems.
Together the Bn and Sc fields elevate the use of simulation from an observational tool which identifies heat management problems to an effective thermal design problem-solving tool which suggests potential solutions.
Two additional improvements to the new FloTHERM version 9 product: XML model and geometry data importing to enable FloTHERM integration into existing data flows, and a direct interface to the Mentor Graphics’ Expedition PCB design platform. The direct interface helps you import native Expedition PCB data, and delete or edit additional objects such as heat sinks, thermal vias, board cutouts, and EM cans for more accurate thermal model design development.
FloTHERM software helps you to implement virtual prototypes using advanced CFD techniques to simulate airflow, temperature, and heat transfer in electronic systems. This capability enables accurate thermal analysis so you can evaluate and test designs automatically before physical prototypes are built. The software is compatible with other Mentor products to provide comprehensive thermal simulation for optimum system reliability, from IC package to PCB and full system development. FloTHERM is available immediately. To view a demonstration, go to http://www.mentor.com/products/mechanical/products/flotherm.
Filed Under: Packaging, FEA software, Simulation, Software
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