LISLE, Ill. — Molex Incorporated (NASDAQ: MOLX and MOLXA) introduced today the latest addition to its Impact™ backplane connector family of products, Impact 85 Ohm, to meet the growing demands of next generation server, storage and data networking equipment. Molex’s new Impact 85 Ohm connector system is designed to support Intel’s Quick Path Interconnect (QPI®) standard, PCI Express Generation 2.0 and 3.0, as well as any proprietary system design where 85 Ohm differential impedance is desired.
To allow designers the flexibility of interchanging 100 Ohm and 85 Ohm signal modules based on system needs, Molex designed the Impact 85 Ohm connector and the Impact 100 Ohm connector system to be the same physical size, same density, same pitch, same PCB layout, and to use the same guidance and power solutions. Impact 85 Ohm is offered in a light gray LCP so designers can visually “color code” their designs to avoid confusion between the Impact 85 Ohm and the 100 Ohm lines.
Impact 85 Ohm also utilizes the existing Impact 100 Ohm connector compliant pin and mating interface designs, saving designers the time and cost to re-qualify the critical-to-function portions of the connector system. These proven designs offer superior electrical and mechanical performance compared to other backplane connectors on the market today.
Molex continues to expand its Impact backplane connector family. It is now tooled and available in 2-, 3-, 4-, 5-, and 6- pair traditional backplane header and daughtercard connector versions that support differential signal densities ranging from 27 up to 80 pairs per linear inch, with a complete range of guidance, power, coplanar, mezzanine and high performance cable solutions.
For more information on Molex's Impact backplane connector system, visit http://www.molex.com/link/Impact.html.
Filed Under: Connectors (electrical) • crimp technologies, Electronics • electrical