Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

Molex Sockets Earn Intel® Validation

By Patrick Curran | February 12, 2010

Share

Molex Incorporated (NASDAQ: MOLX and MOLXA) has announced that three of its socket products have met the stringent criteria for Intel® validation. Molex is one of only three vendors whose socket product families are validated across all three computer market segments of server, desktop and notebooks. As an Intel-enabled vendor, Molex sockets are compatible with Intel’s reference design and passed the criteria set for electrical performance and long term reliability with Intel’s CPUs.

The sockets include:

• Molex LGA 1366 Server CPU Socket: The LGA 1366 (Land Grid Array) is a server CPU socket designed for Intel’s* Nehalem micro-architecture that uses an LGA 1366-pin packaging and smaller pitch size of 1.016 by 1.016mm (.040 by .040”). Also known commonly as Socket B, socket 1366 or LGA 1366, this socket mates with the server processor through the gold pads of the LGA 1366 package. More information is available at http://www.intel.com/design/corei7/components/LGA1366/ and http://www.molex.com/product/lga1366.html.

• Molex LGA 1156 Desktop CPU Socket (pictured): The LGA 1156 (Land Grid Array) is a desktop CPU socket. It is designed for Intel’s Nehalem micro-architecture that uses an LGA 1156-pin packaging and smaller pitch size of 0.9144 by 0.9144mm (0.037 by .037”) Also know commonly as Socket H1, Socket 1156 or LGA 1156, this socket mates with the desktop PC processor through the gold pads of the LGA 1156 package. More information is available at http://www.intel.com/design/corei7/components/ and http://www.molex.com/product/lga1156.html.

• Molex rPGA 989/988 Notebook PC CPU Socket: The rPGA 989/988 (Reduced Pin Grid Array) is a Notebook PC CPU socket designed for Intel’s* Nehalem micro-architecture that uses a Pin Grid Array (PGA) 989 or 988-pin packaging with a reduced pitch size of 1.00 by 1.00mm (.039 by .039″) . Also known commonly as Socket G1, Socket 989 or rPGA 989/988, this socket mates with the Notebook PC processor through the gold pins of the rPGA 989/988 package. More information is available at http://www.intel.com/products/processor/core/mobile/components.htm and http://www.molex.com/product/rpga989.html.

Molex Incorporated
www.molex.com


Filed Under: Computer boards, Connectors (electrical) • crimp technologies, Electronics • electrical
Tagged With: Molex
 

Tell Us What You Think!

Related Articles Read More >

molex-premo-flex
Premo-Flex one-touch flat flexible cable (FFC) jumpers
Heilind Electronics expands Hirose offering with D.FL75 professional video series micro coaxial connector
Heilind Electronics expands cable management portfolio with HellermannTyton In-Line Ratchet P-Clamp
Heilind Electronics announces Technology Now: Power Up virtual expo

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings