Comsol Multiphysics 5.2a has a number of user-driven features and enhancements that focus on accuracy, usability, and productivity. From new solvers and methods, to application design and deployment tools, software version 5.2a expands the electrical, mechanical, fluid, and chemical design and optimization capabilities.
Three new solvers deliver faster and more memory efficient computations. The smoothed aggregation algebraic multigrid (SA-AMG) solver handles linear elastic analysis, but is also applicable to other types of analyses. This solver is memory conservative, making it possible to run structural assemblies with millions of degrees of freedom on a standard desktop or laptop computer.
The domain decomposition solver handles large multiphysics models.
A new explicit solver based on the discontinuous Galerkin (DG) method for acoustics in the time-domain is available. Combining the discontinuous Galerkin method with the new absorbing layers in the time-domain results in memory efficiency.
The complete suite of computational tools allows users to create apps for the benefit of colleagues and customers. With version 5.2a, app designers can build more dynamic apps where the appearance of the user interface can change during run time, centralize unit handling to better serve teams working across different countries, and include hyperlinks and videos.
Apps can be deployed throughout organizations using the COMSOL Client for Windows or web browser by connecting to a COMSOL Server installation.
Version 5.2a features include core technology to specialized boundary conditions and material libraries. For example, the tetrahedral meshing algorithm with an included quality optimization algorithm makes it easy to create coarse meshes to study complicated CAD geometries that feature thin parts. Visualizations include annotations with LaTeX formatting, improved table surface plots, VTK export, and new color tables.
FEATURES INCLUDE:
1/ GEOMETRY AND MESH: The enhanced tetrahedral meshing algorithm creates coarse meshes for complicated CAD geometries that feature thin parts. An optimization algorithm built into the mesher is available for improving element quality, which may improve the accuracy of a solution and make it faster to converge. Interactive drawing for 2D geometries now features better coordinate display and snapping points.
2/ MATHEMATICAL MODELING TOOLS, STUDIES, AND VISUALIZATION:
Three new solvers are introduced: the smoothed aggregation algebraic multigrid method (SA-AMG), the domain decomposition solver, and the discontinuous Galerkin (DG) method. Users can now save data and plots added to the Export node under Results in VTK format, making it possible to import COMSOL simulation results and meshes to 3rd party software.
3/ ELECTRICAL: The Ac/dc Module features a material model for magnetic hysteresis built-in called Jiles-Atherton. The lumped two-port network coupling is in the RF Module, allowing for lumped modeling to represent parts of a microwave circuit in a simplified way without having to model the details.
4/ MECHANICAL: The Structural Mechanics Module includes the adhesion and decohesion features, available as a subnode under
the Contact feature. A Magnetostriction physics interface supports both linear and nonlinear magnetostriction. The nonlinear material modeling capabilities have been expanded with plasticity models, mixed isotropic and kinematic hardening, and large-strain viscoelasticity.
5/ FLUID: The CFD Module and Heat Transfer Module includes a feature that adds a gravity force and concurrently compensates for the hydrostatic pressure on boundaries. A linearized density option in Non-Isothermal Flow, a common simplification for natural convection flows, is available.
6/ CHEMICAL: Battery manufacturers and designers can model complex 3D assemblies in battery packs using the Single Particle Battery physic interface available in the Batteries & Fuel Cells Module. Additionally, a Reacting Flow Multiphysics physics interface is available.
COMSOL
www.comsol.com/release/5.2a
Filed Under: 3D CAD, TECHNOLOGIES + PRODUCTS
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