BURLINGTON, MA — More than 700 of the world’s top practitioners of multiphysics simulation recently gathered for the fifth annual COMSOL Conference in October. Complementary events were held in Boston and then Milan, Italy. The next stop for the annual world tour of this conference focused on multiphysics modeling and simulation for engineering and scientific research is Bangalore, India, November 13-14, 2009, followed by additional conferences in Shanghai, Beijing, Tokyo, and other locations.
Highlighting this year’s events was the release of a beta edition of COMSOL Multiphysics 4.0, the newest version of the company’s market-leading multiphysics modeling and simulation environment, which was distributed to all attendees and media contacts. Among the many enhancements in Version 4.0 is the COMSOL Desktop™, an all-new user interface that makes it easy for users to build and run simulations.
The Boston conference, held at the Boston Marriott in Newton, MA, attracted more than 300 COMSOL Multiphysics users from 11 countries. Attendees represented nearly 200 different companies as well as military and scientific research centers and academic institutions. More than a dozen media and industry analysts attended the Boston event including media sponsors NASA Tech Briefs, Design World, Chemical Engineering Progress, Design News, Desktop Engineering, and Microwave Journal. Exhibitors and conference sponsors included SolidWorks, The MathWorks, AltaSim Technologies, Jones and Bartlett Publishers, Lynntech, Pryor Knowledge Systems, World Scientific Publishing and as well as several media sponsors..
The Boston conference offered attendees more than 130 user presentations as well as nearly three dozen minicourses and tutorial sessions on such topics as AC/DC systems, acoustics, bioengineering, chemical engineering, earth science and porous media flow, electrostatics and electromagnetics, fluid dynamics, fluid structure interactions, heat transfer, materials science, MEMS, microfluidics, microwaves and RF, optics, parallel processing, thermo-mechanics, structural mechanics, and scientific and engineering education. Keynote speakers included Dr. Darrell Pepper from the University of Nevada – Las Vegas, Edwin Ethridge of NASA’s Marshall Space Flight Center, Marc K. Smith from Georgia Institute of Technology, and Michael A. Vallance of GE Global Research.
The conference also included a large poster session and a banquet dinner honoring the best technical papers as voted on by the program committee and best posters as voted on by the a panel of judges as well as a popular vote. The opening night networking reception was sponsored by NASA Tech Briefs.
“Over the last few years the use of multiphysics simulation has grown rapidly, especially within engineering and R&D,” comments Svante Littmarck, President and CEO of COMSOL. “Attendance at this year’s Boston and Milan user conferences broke all previous records by more than 20 percent. This is a testament to the importance of multiphysics simulation in industry and research today.”
As in Boston, attendees at the COMSOL Conference in Milan, Italy, held at the Leonardo da Vinci Hotel – Convention Center, had their choice of 139 user presentations as well as nearly 30 minicourses and tutorial sessions. Keynote speakers in Milan included Vincenzo Guida from Procter & Gamble – Italy, Bertrand Baudouy of CEA Saclay, Jan Przybyla from e2v Technologies, and Filip Van den Abeele from OCAS. Among the additional event sponsors for the Milan COMSOL Conference were Materialise, Simpleware, SpaceClaim, and Validus Engineering. Seven media sponsors, including Fiera Milano Editore and Physics World, attended the event.
The 2009 COMSOL Conference next convenes at the ITC Windsor Hotel in Bangalore, India, November 13-14, 2009. A complete description of the 2009 COMSOL Conference-Bangalore is available on the COMSOL website.
Localized versions of the 2009 COMSOL Conference will be held throughout the Pacific Rim during November and December. The final stop for the 2009 COMSOL Conference will be Seoul, South Korea, on December 8. For a complete list of dates and locations, conference registration details, or for more information about COMSOL Multiphysics 4.0, visit the COMSOL Inc. website.
Filed Under: Software • FEA, Software • simulation, ENGINEERING SOFTWARE