Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

NASA selects Thermacore for study of spacecraft thermal control

By atesmeh | September 3, 2013

Share

Thermacore was recently selected by NASA Space Technology’s Game Changing Development Program to have one of its unique thermal management concepts evaluated for potential use in future spacecraft.

NASA’s Game Changing Development Program released a solicitation to the nation to help solve a challenging spacecraft thermal management issue, specifically, to help meet the difficult challenge of creating systems that can reject high heat loads in a warm thermal environment, yet operate in a very cold environment, where maintenance is often difficult or impossible. Thermacore and seven other researchers were selected by NASA based on their unique technical solution. A complete range of public and private R&D organizations, educational institutions and industrial centers worldwide were eligible for selection.

The proposed Thermacore solution is an improved variable-conductance heat pipe (VCHP) containing a novel working fluid that operates in a very wide temperature range, which uses a proprietary orifice disk (patent pending) for fluid movement control. The new disk and working fluid allows the VCHP to operate effectively in a wider range of applications than standard heat pipes, including long-term space flight. The improved VCHP can also use standard working fluids, making it more cost-effective and with lower mass than conventional VCHP’s used today.

Thermacore design and technology capabilities are also supporting the concept submitted by another NASA selectee, UTC Aerospace Systems’ Hamilton Sundstrand Space Systems International, Inc. of Windsor Locks, Conn., which is developing a robust freeze start-up radiator.

“Our selection by NASA reflects our ability to combine proven technology, already operational in spacecraft, with newly-developed enhancements that extend our heat pipe capabilities,” said Gregg Baldassarre, Thermacore Vice President, Sales and Marketing. “We’re proud to be part of this exciting program focused on the future of space exploration.”

The NASA Game Changing Development Program is a four-phase initiative. Phase I is designed to study the feasibility of the thermal management concepts involved. Once the concepts are approved for further development, future phases will involve benchtop testing, detailed drawings for a scaled-down model, and in Phase IV, fabrication of a prototype for testing. Completion of all four phases is expected to take approximately three years.

For information about Thermacore, visit www.thermacore.com.


Filed Under: Aerospace + defense

 

Related Articles Read More >

Mars helicopter receives Collier Trophy
Flexible rotary shafts to power Delta Airlines’ engines powering their first Airbus A321neo aircraft
Ontic acquires Servotek and Westcon product lines from Marsh Bellofram
Flexible rotary shafts support thrust reverser on 150 LEAP 1-A turbofan engines

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Renishaw next-generation FORTiS™ enclosed linear encoders offer enhanced metrology and reliability for machine tools
  • WAGO’s smartDESIGNER Online Provides Seamless Progression for Projects
  • Epoxy Certified for UL 1203 Standard
  • The Importance of Industrial Cable Resistance to Chemicals and Oils
  • Optimize, streamline and increase production capacity with pallet-handling conveyor systems
  • Global supply needs drive increased manufacturing footprint development

Design World Podcasts

June 12, 2022
How to avoid over engineering a part
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings