Image credit: Delo Adhesives
Using a new technique for glob top adhesives, Delo Adhesives has released a coating that provides a thin, uniform, passivation layer for small chips, such as MEMS sensors.
The die coating adhesive coats a chip in a jacket less than 100 µm thick which covers even very thin chip corners but does not extend beyond the chip edges. With the increasing emphasis on miniaturization in microelectronic packaging, glob top materials need to be able to adhere as flat as possible to the surface of the chip. Delo uses heat-curing acrylates in order to achieve this flat surface, which conforms to mobile phone manufacturers’ requirements that limit the thickness of MEMS packages to a maximum of 0.6mm.
Delo’s new line of adhesives for die coating also include low viscosity along with their particular flow properties, which means that they can be processed using jetting and achieve a homogenous flat surface if applied in just a few drops. A shore hardness of A60 means that the chip and wires are protected from stresses. In addition, the coating’s black coloring protects the device’s logic structures against light intrusion and intellectual property theft.
Delo Adhesives is based in Bavaria and has subsidiaries in Singapore, China, and the United States.
Filed Under: Materials • advanced
