GE Intelligent Platforms announced the bCOM6-P1100 Rugged Type 6 COM Express Module, a board designed for deployment in challenging or harsh commercial environments such as mining, forestry, construction, oil & gas, food & beverage, networking, industrial automation control and power & energy. The company has incorporated its extensive experience in developing high performance rugged solutions for military applications into this new product.
The bCOM6-P1100, which expands GE’s COM Express portfolio by adding a Freescale™ PowerPC™ processor, also takes advantage of GE’s expertise in the optimization of thermal performance.
GE specifically selected on-board components for their reliability in demanding conditions, and, unlike solutions designed for benign environments, processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.
The small form factor of the COM Express architecture is attractive to organizations looking to deploy embedded computing in constrained environments, while its separation of processor and carrier board allows simple, cost-effective upgrades that enable optimum operation to be maintained, minimize re-qualification costs, maximize asset performance and decrease lifetime cost of ownership.
For OEMs and systems integrators looking for solutions that deliver high performance coupled with low power consumption, the bCOM6-P1100 offers a range of two Freescale PowerPC QorIQ processor options, with performance between 800MHz and 1.2GHz (x2) and power consumption between 3.5W and 13.0W. Up to 8GB of DDR3 SDRAM with ECC can be configured, allowing the most demanding applications to be deployed.
Filed Under: Factory automation, Computer boards