Intel’s latest generation of Xeon processor offers the computer power needed for 4K graphics and 360-degree video. Concurrent Technologies now supports the new Intel Xeon E3-1500 v6 with a module appropriate for high-speed physics, test-based applications, and instrumentation.
Concurrent recently unveiled its first product based on the chip, a new AdvancedMC (AMC) module, AM G6x/msd. Capitalizing on Intel’s new product line – previously known as Kaby Lake – allows Concurrent to expand performance and storage capacity while continuing to offer long-living boards that don’t require human monitoring. The new module offers improved CPU and memory performance compared to previous Concurrent Technologies AMC products. One version offers dual 10 Gigabit Ethernet connectivity through either electrical or fiber links.
The AM G6x/msd is available with a choice of processors, either the Intel Xeon E3-1505M v6 or Intel Xeon E3-1505L v6. Both include an onboard 64GB Solid State Drive (SSD) for Operating System and application storage, 4 cores with Intel HD Graphics P630, and two sites for M.2 storage modules. These are based on PCO Express M-key interconnects, which support the Non-Volatile Memory Express® (NVMe) protocol for solid state drive storage performance.
“We have an excellent reputation in the test and high-speed physics community for supplying AdvancedMC processor modules that work reliably for many years without human interaction,” Concurrent Technologies chief executive officer Glen Fawcet said in a press release. “We are expecting our AM G6x/msd to continue this trend whilst satisfying a need for additional performance and local storage capacity brought about largely as a result of using the latest generation of processor and chipset from Intel.”
Filed Under: Rapid prototyping
