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P10 integrated circuit provides powerful performance, capabilities

By Paul Heney | May 6, 2020

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Divelbiss Corp. has announced the second generation P10 PLC on a Chip embedded, single chip, programmable logic controller. The new smaller footprint P-10 PLC on a Chip has similar capabilities and performance as the larger P13 PLC on a Chip, but in a LQFP144 package.

“The PLC on a Chip family of products can be applied quickly and cost-effectively,” said Terry Divelbiss, the company president. “The new P-10 is an easy-to-use solution with enhanced functionality that helps companies take products to market quickly.”

Features on the new P10 PLC on a Chip include: Ethernet communications including support for multi-port physicals, serial communications, 2 CAN ports, Wi-Fi and Cellular with protocol support including Modbus TCP, Modbus Master, Modbus Slave, SAE J1939, NMEA 2000, COAP and MQTT, enhanced counter/timer functionality, up to 106 digital I/O, up to eight 12-bit analog inputs and one 10-bit analog output, integrated real time clock, SD card interface, I2C ports, SPI ports, quadrature counter, keypad and display interface, expanded user memory on chip, and accelerated scan times.

The P-10 PLC on a Chip can be added to any embedded application, with no low-level programming required. After integration into any product, the user’s application program can be entered and monitored using the Divelbiss EZ Ladder Toolkit. This advanced programming tool supports features including: Ladder diagram, Function Block and Structured Text. Over 110 standard function blocks are supported and the ability to add custom functions and function blocks using Structured Text.

The P10 PLC on a Chip has a temperature range from -40° to 85° C and can be embedded in electro-hydraulic and mobile equipment, motor drives, HMI’s, packaging equipment, telematics, remote field applications and various other applications.

Divelbiss Corp.
divelbiss.com

About Paul Heney

Paul J. Heney, the VP, Editorial Director for Design World magazine, has a BS in Engineering Science & Mechanics and minors in Technical Communications and Biomedical Engineering from Georgia Tech. He has written about fluid power, aerospace, robotics, medical, green engineering, and general manufacturing topics for nearly 25 years. He has won numerous regional and national awards for his writing from the American Society of Business Publication Editors.

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