How can you implement packaging designs that make higher quality products while reducing the amount of packaging materials? How can you reduce the energy consumption of the entire packaging process? PC-based control and drive technology are ideally suited to dealing with these challenges, controlling and monitoring the entire process of individual packaging machines and complete packaging lines. At the same time PC-based control meets the requirements for high quality, flexibility, and, most important of all, resource-saving packaging production.
PC Control and integrated process communication with EtherCAT are the basis for fast control and regulation technologies. By leveraging these technologies, precise process cycles can be achieved so that the packaging can be manufactured with less raw materials and the specified quantities of goods to be packed can be adhered to with greater accuracy. The result is considerable cost savings while minimizing the use of raw materials and energy.
Implementing PC control ensures that the consumption of resources is reduced to a minimum. What makes the difference is XFC (eXtreme Fast Control) technology. With I/O response times of < 100 μs, processes can be controlled with exceptional precision and repeat accuracy.
PC- and EtherCAT-based control ensures synchronized processes and motion control sequences with shorter cycle times for increased throughput. The technology’s quick and precise response to print marks makes it possible to save packaging materials, for example, by placing products more closely together in blister packs, which reduces the amount of sealing foil needed as well as any waste. In addition, the ability to precisely control the sealing temperature enables users to work with thinner plastic films. The fast and highly accurate process control capabilities can minimize the wall thickness of PET bottles or reduce the amount of paper and aluminum when producing different types of containers. Also important to consider, the more accurate approximation of minimum fill levels generates significant material and cost savings when packaging high-volume products.
Filed Under: TECHNOLOGIES + PRODUCTS, ALL INDUSTRIES, Design World articles, Packaging, I/O modules