The 2017 COMSOL Conference, held in seven locations across the globe, brought together thousands of engineers, researchers, and designers worldwide. Attendees connected and exchanged best practices in mathematical modeling and multiphysics simulation. Keynote presentations were delivered by industry leaders such as Amgen, W. L. Gore and Associates, and STMicroelectronics. Attendees also got a behind the scenes look at how these organizations develop their designs. Many talks shared how to capitalize on the power of multiphysics modeling by expanding its reach through custom simulation apps.
Users of the COMSOL Multiphysics software presented posters and papers sharing their work and insights of numerical simulation. Areas covered include structural mechanics, CFD, heat transfer, electromagnetics, acoustics, and chemical engineering. Engineers from MIT, Oak Ridge National Laboratory, and Beth Israel Deaconess Medical Center, among others showed how they are using multiphysics simulation to advance their work. To learn from others, browse through the hundreds of papers and posters that are now publicly available online at www.comsol.com/2017-user-
The 2017 COMSOL Conference kicked off in Boston before heading to Rotterdam, Beijing, Singapore, Taipei, Seoul, and Tokyo. Each location had a program committee of simulation specialists from industry and academia review the submissions and select the winners. The winners recognized with Best Paper and Best Poster awards can be found at www.comsol.com/2017-user-
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