In response to the surging demand for multi-card mobile devices, TE Connectivity (TE) today launched its latest push-push SIM connector, featuring dual-slanted contacts that provide a stable connection and super low-profile design that enables sleeker product design – ideal for handset, tablet, personal GPS, laptop, ultrabook and server applications.
According to a market survey by GfK Market Research in 2011, multi-SIM use is set to grow exponentially, especially in newer and more emerging markets. “The multiple SIM facilitates the consumer-lead desire to utilize different tariffs throughout the week, depending on time and usage,” the report said .
“With its innovative design and quality construction, the new push-push SIM connector is our solution to the growing market demand for multi-card devices,” said Youichi Kashiwa, product general manager, TE Consumer Devices. “TE has worked closely with leading mobile device manufacturers in the development and launch of this new product.” The smooth push-push mechanism makes it easier for users to eject a SIM card, while the dual slanted contact design helps avoid contact jams from hooking housing components underneath and provides better mating performance during drop test.”
On the other hand, TE’s new push-push SIM connector is an ideal solution for slim mobile devices. The super low-profile design provides connector height of only 1.4mm, which is 25% thinner than existing products and significantly helps reduce the height of end devices.
Consumers also yearn for a more polished user experience. TE’s new push-push SIM connector features a card detect switch that enables hot swap and a wider card slot compatible with all SIM cards. In addition, the connector’s half-moon shape opening strengthens EMI protection. Extra open space at the front side of the housing helps prevent finger cuts when inserting or extracting the card. Multi SIM phenomenon continues in emerging mobile markets
Filed Under: Connectors (electrical) • crimp technologies, Electronics • electrical