A new approach to custom Wafer-Level Packaging (WLP) uses reflow compatible materials as well as custom designs and image sensors to deliver one of the smallest and thinnest form factors available. With WLP, you can create chip scale packages with only 400 µm as the minimum thickness. Die sizes can be 0.6 mm, which fits up to 40,000 dies per wafer.
With reflow compatible materials and without configured design rules, Nemotek Technologie engineers can build a custom package that efficiently mounts directly to an application assembly board. They have developed a system that delivers Through Silicon Via (TSV) for thin, reliable, and complex imaging components for mobile applications including camera phones, computers, and other devices used in medical or automotive products. This system also offers Ball Grid Array (BGA) termination without wire bonding. The elimination of wire bonding reduces size and less space requirements on the board and final packaging.
“Flexibility in our design of WLP meets customer demands for tailored solutions based on advanced wafer-level technology,” said Jacky Perdrigeat, CEO of Nemotek Technologie. “We can ensure design flexibility in a small form factor, and improve the manufacturing process and serve wafer-level needs.”