Rogers Corporation (NYSE:ROG) will display a sampling of its wide array of electronic printed-circuit-board (PCB) material solutions at the upcoming IPC Midwest Conference & Exhibition, September 21-22, in the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, IL (Booth #219). One week later they will be exhibiting at the PCB West Conference & Exhibition, September 28th, in the Santa Clara Convention Center in Santa Clara, CA (Booth #101).

Rogers will feature materials specifically designed for RF as well as digital applications, including its Thetaâ circuit materials, RT/duroid® 6035HTC and RO4000® LoPro™ laminates. Halogen-free Theta materials exhibit dielectric constant of 3.8 with low dissipation factor of only 0.008 at 1 GHz, making them suitable for high-speed digital circuits requiring environmentally friendly, lead-free processing. The RoHS-compliant material features low z-axis coefficient of thermal expansion (CTE) for reliable plated through holes (PTHs) in multilayer circuits.

RO4000 LoPro circuit materials are a low-profile copper foil option available on the RO4000 series that helps designers significantly drive down insertion loss. This low cost enhancement to the RO4000 series of dielectric materials is fully compatible with FR-4 fabrication processes and suitable for high-frequency RF analog circuits and digital transceiver applications.

 

Rogers RT/duroid 6035HTC laminates are engineered for high-power RF and microwave applications such as power amplifiers and antenna beam-forming networks. The high-thermal-conductivity (HTC) fluoropolymer composite contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear versus some competitive offerings. The thermally stable material has a z-axis dielectric constant of 3.5 at 10 GHz, low loss by virtue of a loss tangent of 0.0013 at 10 GHz, and is available with reverse-treated, electrodeposited copper foil.

PCB West Conference attendees can learn about selecting PCB materials for optimal thermal management by attending John Coonrod’s presentation on Sept. 28 @ 4:00 p.m. (paper F8: “Using High Frequency PCB Laminates for Improving Thermal Management Issues.”) John Coonrod is a Market Development Engineer for Rogers Corporation.

Rogers Corporation
www.rogerscorp.com

::Design World::

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Filed Under: Semiconductor, Electronics • electrical, Materials • advanced

 

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