Design World

  • Home
  • Technologies
    • ELECTRONICS • ELECTRICAL
    • Fastening • joining
    • FLUID POWER
    • LINEAR MOTION
    • MOTION CONTROL
    • SENSORS
    • TEST & MEASUREMENT
    • Factory automation
    • Warehouse automation
    • DIGITAL TRANSFORMATION
  • Learn
    • Tech Toolboxes
    • Learning center
    • eBooks • Tech Tips
    • Podcasts
    • Videos
    • Webinars • general engineering
    • Webinars • Automated warehousing
    • Voices
  • LEAP Awards
  • 2025 Leadership
    • 2024 Winners
    • 2023 Winners
    • 2022 Winners
    • 2021 Winners
  • Design Guides
  • Resources
    • Subscribe
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Educational Assets
    • Engineering diversity
    • Trends
  • Supplier Listings
  • Advertise
  • Subscribe

Rogers High Performance Circuit Materials at Del Mar Electronics Show

By Frank Tobe | April 16, 2014

Rogers Corporation (NYSE:ROG) will be showing samples of the company’s wide range of printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show (DMEDS, www.electroshows.com/delmar) April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA.

Rogers

Representatives from Rogers Corp. will be at Booth 622 with information and insight on the use of their circuit materials, including COOLSPAN® TECA film, RO4835™ high-frequency laminates, and RO4360G2™ high-frequency laminates.

Rogers COOLSPAN TECA film is a thermally and electrically conductive adhesive that is ideal for bonding circuit boards to heavy metal backplanes, heat sinks, and housings. The thermosetting, epoxy-based, silver-filled adhesive is a practical alternative to fusion bonding, sweat soldering, press-fit, and other mechanical approaches for attaching circuits to associated structures. COOLSPAN TECA film, which is supplied in sheet form on a PET carrier, is able to survive lead-free solder processing and offers outstanding chemical resistance and high temperature performance, helping you to keep things cool.

Rogers RO4835 high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. Just as with RO4350B™ material, RO4835 laminates offer a dielectric constant of 3.48 at 10 GHz, a low loss tangent of 0.0037 at 10 GHz, and a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety of processing and operating conditions. These improved oxidation resistance circuit materials exhibit x- and y-axis expansion coefficients similar to that of copper. RO4835 laminates are RoHS-compliant, do not require special preparation, and can be processed using standard fabrication methods.

RO4360G2 laminates have a tailored high Dk of 6.15 @ 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminate’s higher Dk allows for a significant reduction in finished circuit board size (20-30%). RO4360G2 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B material.

With a UL 94V-0 flame rating and fully lead-free process capable, these laminates possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B laminates.

Rogers
www.rogerscorp.com

You Might Also Like


Filed Under: Materials • advanced, ELECTRONICS • ELECTRICAL
Tagged With: Rogers
 

LEARNING CENTER

Design World Learning Center
“dw
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for Design Engineering Professionals.
Motor University

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Widening the scope for machine tool designers with FORTiS™ enclosed encoder
  • Sustainability, Innovation and Safety, Central to Our Approach
  • Why off-highway is the sweet spot for AC electrification technology
  • Looking to 2025: Past Success Guides Future Achievements
  • North American Companies Seek Stronger Ties with Italian OEMs
  • Adapt and Evolve
View More >>
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Control Engineering
  • Consulting-Specifying Engineer
  • Plant Engineering
  • Engineering White Papers
  • Leap Awards

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • ELECTRONICS • ELECTRICAL
    • Fastening • joining
    • FLUID POWER
    • LINEAR MOTION
    • MOTION CONTROL
    • SENSORS
    • TEST & MEASUREMENT
    • Factory automation
    • Warehouse automation
    • DIGITAL TRANSFORMATION
  • Learn
    • Tech Toolboxes
    • Learning center
    • eBooks • Tech Tips
    • Podcasts
    • Videos
    • Webinars • general engineering
    • Webinars • Automated warehousing
    • Voices
  • LEAP Awards
  • 2025 Leadership
    • 2024 Winners
    • 2023 Winners
    • 2022 Winners
    • 2021 Winners
  • Design Guides
  • Resources
    • Subscribe
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Educational Assets
    • Engineering diversity
    • Trends
  • Supplier Listings
  • Advertise
  • Subscribe
We use cookies to personalize content and ads, to provide social media features, and to analyze our traffic. We share information about your use of our site with our social media, advertising, and analytics partners who may combine it with other information you’ve provided to them or that they’ve collected from your use of their services. You consent to our cookies if you continue to use this website.