Advanced Circuit Materials Division recently introduced improved high frequency materials to address several market needs. The improved RO4700JXR Series antenna grade laminates were designed for use in base station, RFID and other antenna designs and combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss. The specially formulated RO4700JXR thermoset resin system incorporates a hollow microsphere filler resulting in a light weight, low density laminate, which is approximately 30% lighter weight than woven-glass PTFE materials. In addition, RO4725JXR™ (2.55Dk) & RO4730JXR™ (3.0 DK) laminates provide a lower cost solution for high frequency circuit boards used in base station and other antennas.
RO4700JXR laminates feature a low Z-axis coefficient of thermal expansion (CTE of <30 PPM/ºC) for design flexibility. With a TCDk <40 PPM/ºC, the laminates provide consistent circuit performance regardless of short term temperature variations. They feature the same high glass transition temperature (Tg) as Rogers’ other high-performance RO4000® laminates, greater than 280ºC, making them lead-free and automated assembly compatible.
RO4700JXR series RoHS-compliant laminates are compatible with standard PCB fabrication techniques and plated-through-hole (PTH) processing. Designed for base station and other RFID antennas, the proprietary, halogen-free laminates support longer drill tool lifetimes than other filled materials, reducing fabrication costs.
Filed Under: Wireless, Electronics • electrical, Materials • advanced