Rogers Introduces XT/duroid™ High Performance Thermoplastic Laminates

Chandler, AZ – Rogers Corporation has introduced its new XT/duroid™ high performance thermoplastic laminate materials, ideal for high frequency multilayer circuits in the most demanding operating environments. The XT/duroid product line includes XT/duroid 8000 laminates for multilayer designs with as many as five layers and XT/duroid 8100 laminates for constructions with six or more circuit layers. Both laminates feature thin halogen-free dielectrics and are available with low-profile copper foil cladding for use in double-sided and multilayer printed circuit boards (PCBs). Low profile copper bonded directly to the dielectric without the use of adhesives results in low insertion loss for these thin materials.

Rogers’ new XT/duroid product line consists of XT/duroid 8000 and XT/duroid 8100 laminates for multilayer circuit applications.

The highly reliable, flame-retardant laminates are thermally and chemically robust with extremely high melting points, making them well suited for rugged military and aerospace applications, including airborne lightning strike protection circuits, phased-array antennas, and unmanned aerial vehicles (UAVs). These materials exhibit low outgassing characteristics, required for use in high-vacuum, deep-space applications.

Rogers’ new XT/duroid 8000 laminates feature a z-axis dielectric constant of 3.23 ±0.05 at 10 GHz and a dissipation factor of 0.0035 or less at 10 GHz. They deliver stable electrical performance over wide frequency ranges, with a low thermal coefficient of dielectric constant of +7 ppm/°C from -50 to +150°C. They also exhibit excellent thermal conductivity of 0.35 W/m/°K.

XT/duroid 8000 laminates can withstand extreme thermal conditions, with an estimated maximum operating temperature of greater than +210°C and melt temperature well beyond that of PTFE-based circuit materials. XT/duroid 8000 circuit materials are designed for ease of processing, and are compatible with lead-free-solder assembly methods.

For more complex multilayer circuit constructions requiring excellent stability, XT/duroid 8100 laminates benefit from the additional dimensional stability of a reinforced woven-glass resin system. As a result, they can support multilayer circuits of six and more layers while providing the thermal and chemical ruggedness, and outstanding electrical performance, of XT/duroid 8000 laminates. Both laminate materials are available with dielectric thickness of 0.002 in. (0.0508 mm) with 0.5-oz. low-profile electrodeposited copper foil cladding. XT/duroid 8100 is also available with dielectric thickness of 0.004 in. (0.1016 mm)

Rogers Corporation
www.rogerscorp.com

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