Rogers Corporation will be participating in the PCB West 2012 Conference & Exhibition, September 25-27, in both the technical program and the exhibition floor.
Visitors to Rogers’ Booth #101 are invited to find out how halogen-free Theta® circuit materials can improve the performance of their high-speed digital circuits. These RoHS-compliant, laminate and prepreg products exhibit minimal conductor and dielectric losses, helping circuit designers to achieve excellent signal-integrity (SI) performance in high-speed digital designs. Theta laminates feature a relative dielectric constant of 3.90 in the z-axis at 1 GHz, with a dissipation factor of only 0.009 at the same frequency. They deliver high reliability, thanks to a z-axis coefficient of thermal expansion (CTE) of only 50 ppm/°C, or about 30% lower than standard FR-4 circuit materials. This translates into improved reliability of plated through holes (PTHs), buried blind viaholes, and stacked viaholes in multilayer structures requiring multiple lamination cycles. With a high glass transition temperature (Tg), Theta materials are suitable for high-yield, lead-free processing.
PCB 2011 Conference Booklet
Visitors can also learn about their new 2929 bondply material. This unreinforced thermoset resin-based thin-film adhesive system is ideal for reliable, multilayer circuit constructions. It has a low dielectric constant of 2.94 in the z-axis at 10 GHz, with a low loss tangent of less than 0.003 also in the z-axis at 10 GHz.
Rogers Market Development Engineer, John Coonrod, will present an “Overview and Comparison of Microwave PCB Transmission Line Circuits,” for PCB designers and engineers at all levels. The presentation will cover the basic transmission-line structures used in microwave circuits, including microstrip, stripline, and coplanar waveguide (CPW), and how improved knowledge of these circuit structures can even aid designers of high-speed digital circuits.
PCB West 2012 Conference & Exhibition
www.pcbwest.com
Rogers Corporation
www.rogerscorp.com
Filed Under: Adhesives • epoxies, Material handling • converting
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