CHANHASSEN, MN – The Bergquist Company announces the launch of its latest S-Class gap filling material – Gap Pad 1500S30. Gap Pad 1500S30 maintains a conformable, highly elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. This fiberglass-reinforced, silicone-based material is highly compliant and is ideal for decreasing strain on fragile component leads and solder balls.
Gap Pad 1500S30 provides S-Class performance with exceptional value. This product features an embedded-fiberglass reinforcement for puncture, shear and tear resistance. Dualsided tack eliminates the need for additional adhesive layers that typically inhibit thermal performance by increasing interfacial resistance. Natural tack properties also provide stable release characteristics for clean and easy handling during assembly. Typical applications for Gap Pad 1500S30 include computers and peripherals, power conversion, telecommunications and between any heat-generating semiconductor and a heat sink.
Gap Pad 1500S30 is offered in standard thicknesses of 20 to 125 mil and is available in sheet form or as die-cut parts of most any shape or size. Custom thicknesses are also available upon request. Standard sheet size is 8″ x 16″.