A new range of customizable pressure and thermal sensor solutions from Honeywell includes modules with multiple sensors and technologies integrated inside. Heaters, magnetic, Magneto-resistive, infrared, optical, pressure, thermal, and humidity options are all available for customization. Options include custom interfaces, I/O, size and shape, environmental packaging, and total thermal management solutions—for fast, easy and affordable design options.
The company’s technical support system will allow new and updated designs to be brought to market quicker. The ability to design a custom version of an already approved sensor design often means that device developers do not have to re-certify their upgraded products, saving both time and money.
“It is important to provide customers with exactly what they want, all from a single vendor,” said Valerie Rothermel-Nelson, Honeywell senior global product marketing manager. “This is part of Honeywell’s new systematic method of providing integrated and differentiated value added solutions.”
Our new approach means that we are now providing higher-level assemblies, not just components. “A higher-level assembly is a package that provides differentiated and integrated solutions that ultimately give our customers a competitive advantage. It could be combining more than one sensor into higher level packaging, providing custom termination or even providing total thermal management solutions.”
Filed Under: TECHNOLOGIES + PRODUCTS, Design World articles, Sensors (position + other)