Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

SIA Partners with Government and Universities to Develop Chip Technology

By Editor | January 23, 2013

Share

The Semiconductor Industry Association (SIA) announced a continued partnership between the semiconductor industry and government to fund critical university research to develop the next generation of microelectronics technology. The Semiconductor Technology Advanced Research network (STARnet) will allocate a total of $194 million over the next five years to 39 universities across the country for leading-edge semiconductor research.

STARnet comprises the following six multi-university research centers, which involve a total of 39 universities:

  • the Center for Future Architectures Research (C-FAR), led by the University of Michigan;
  • the Center for Spintronic Materials, Interfaces and Novel Architectures (C-SPIN), led by the University of Minnesota;
  • the Center for Function Accelerated nanoMaterial Engineering (FAME), led by the University of California, Los Angeles;
  • the Center for Low Energy Systems Technology (LEAST), led by the University of Notre Dame;
  • the Center for Systems on Nanoscale Information Fabrics (SONIC), led by the University of Illinois at Urbana-Champaign; and
  • the TerraSwarm Research Center, led by the University of California, Berkeley.

SRC administers the STARnet program. Industry partners include Applied Materials, GLOBALFOUNDRIES, IBM, Intel Corporation, Micron Technology, Raytheon, Texas Instruments and United Technologies.

The STARnet program supports 145 research professors and 400 graduate students at 39 universities overall. The program is also helping develop the next-generation of Ph.D. graduates in electrical engineering, computer science and the physical sciences.

STARnet, one of several government-industry-university partnerships that aim to advance semiconductor technology, is the successor to the existing Focus Center Research Program (FCRP), which was launched in 1997.

For more information about the STARnet program, click here.

Semiconductor Industry Association
www.sia-online.org


Filed Under: Semiconductor
Tagged With: sia
 

Tell Us What You Think!

Related Articles Read More >

sager electronics
Sager Electronics adds electronic CAD file accessibility in online catalog
Samsung Foundry certifies analog FastSPICE platform from Siemens for early design starts on 3nm GAA process technology
richardson
Richardson Electronics to offer Fuji Electric 7th-generation (X-Series) IGBT modules
How to get the most from flash storage

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings