Minneapolis, MN ‚– SICK announces the launch of its W15 Photoelectric Sensors. These high-performance sensors use SICK‚’s third generation custom ASIC (application-specific integrated circuit) chip that incorporates OES3 technology to provide exceptional background suppression at an extended range. OES3 technology enables the W15 to ignore stray background reflections, detect multi-colored/shiny objects without false trips, and provide high immunity to ambient light.
The W15 provides flush mounting that reduces setup time and prevents the disruption of product flow. All W15s are assembled in the U.S. so customization options, such as cable cut to length, cable wrap with customer-specific part number, special connectivity, sensor pre-mounted to a bracket, kitted together with bracket and reflector, can help reduce material and labor costs. The W15‚’s advanced background suppression technology makes it ideal for a variety of applications in the packaging, material handling, and food and beverage markets.
SICK
www.sickusa.com
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Filed Under: Material handling • converting, Packaging, SENSORS, TEST & MEASUREMENT