Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

Sprint’s Massive MIMO Tests with Samsung Yield 330 Mbps on 20 MHz Channel

By Diana Goovaerts | June 20, 2017

Share

Sprint is pushing ahead with its quest for gigabit LTE speeds with a new series of massive MIMO tests with Samsung in South Korea.

The carrier said the tests were conducted in the city of Suwon on 2.5 GHz spectrum using a 32T32R setup. Samsung Electronics America VP and GM Lyle Nyffeler told Wireless Week the trial covered 13 different test cases, including multi-users and non-stationary scenarios. These utilized both vertical and horizontal beamforming, also known as “full dimension MIMO,” which provides coverage not only at the street level but also several stories up.

All told, Sprint reported it was able to achieve speeds of 330 Mbps on a single 20 MHz channel using the massive MIMO and beamforming combination. The experiments also yielded per channel capacity improvements of 4x with a three times boost in cell edge performance, Nyffeler added.

Nyffeler pointed out that the speeds would be significantly higher using carrier aggregation of multiple 20 MHz channels – as Sprint is able to do stateside thanks to its massive trove of 2.5 GHz spectrum. But Sprint indicated it’s planning to take things further still with an end-game that calls for a 64T64R antenna expected to deliver an eight times improvement in capacity.

Back in March, Sprint flexed its gigabit LTE muscles in a demonstration held in New Orleans. That showcase used 4×4 MIMO, 256-QAM, and three-carrier aggregation to deliver speeds well into the 600 Mbps range on a single Motorola prototype device during a network-taxing NBA game in the Smoothie King arena. With Massive MIMO radios using 64T64R, Sprint said it will have the ability to push capacity beyond 1 Gbps to reach 3-6 Gbps per sector.

“The testing in South Korea is an important step towards deploying Massive MIMO in our U.S. network where it will be a key element of LTE Plus as well as 5G,” Sprint COO of Technology Guenther Ottendorfer said in a statement. “Massive MIMO is a tremendous differentiator for Sprint because it is easily deployed on 2.5 GHz spectrum due to the small form factor of the radios needed for a high frequency band. In lower frequency bands, wavelengths are much longer and therefore the radios require much larger, impractical form factors. This makes Massive MIMO an important tool for unleashing our deep 2.5 GHz spectrum holdings.”

While the mystery Motorola handset is expected to be the first to support both 4×4 MIMO and 256-QAM for gigabit speeds, a Qualcomm representative in March told Wireless Week that at least four – but up to 7 – gigabit handsets utilizing the Snapdragon 835 platform will be landing in the United States this year.

More on Sprint’s Massive MIMO ambitions can be found here.


Filed Under: Telecommunications (Spectrum)

 

Related Articles Read More >

HH-Hood-Latch_Image
Southco’s ultra-thin hood latch for limited-space applications
Flying Focus: Controlling Lasers Through Time and Space
AT&T Scoops Up More Spectrum in Mexico at 2.5 GHz Auction
Tuesdays with Roger: New Millimeter Wave Spectrum Auctions

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings