Molex Incorporated introduces modular, stackable HS Stac headers that combine the high-speed USCAR-30 HSAutolink interface with the modular, stackable configuration of the versatile Stac64 connector system. With a 0.80mm pitch, the new HS Stac headers achieve greater design flexibility and space savings in PCB trace routing for in-vehicle infotainment and telematic devices.
The automotive industry-standard interface, known as USCAR-30, supports USB 2.0 requirements and other high-speed technologies, including low voltage differential signaling (LVDS) and Ethernet for infotainment, telematic devices, car stereo and navigation systems, and driver-assist electronic modules. HS Stac right-angle headers package the USCAR-30 interface found in the Molex HSAutoLink family in a rugged, shroud-stackable formation compatible with the widely deployed Molex Stac64 header family. This design creates a unique multi-bay, high-speed connection system to meet growing in-vehicle terminal requirements for devices and modules in automotive and commercial transportation applications. Click here for more information.
Filed Under: Connectors (electrical) • crimp technologies, Electronics • electrical