Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

Step Closer to a Photonic Future

By The Optical Society | February 19, 2014

Share

3D render of the modulator which efficiently imprints electrical data onto an optical light wave. (Mark Wade)Engineers build cutting-edge photonic devices using standard chip-making process

Washington, Feb. 19, 2014–The future of computing may lie not in electrons, but in photons – that is, in microprocessors that use light instead of electrical signals. But these so-called photonic devices are typically built using customized methods that make them difficult and expensive to manufacture.
 
Now, engineers have demonstrated that low power photonic devices can be fabricated using standard chip-making processes. They have achieved what the researchers dub a major milestone in photonic technology. The work will be presented at this year’s Optical Fiber Communication (OFC) Conference and Exposition, being held March 9-13 in San Francisco.
 
The two new devices – a modulator and a tunable filter – are as energy-efficient as some of the best devices around, the researchers say, and were built using a standard IBM advanced Complementary Metal-Oxide Semiconductor (CMOS) process – the same chip-making process used to build many commercially available chips, some of which are found in Sony’s Playstation 3 and also in Watson, the supercomputer that won Jeopardy! in 2011.
 
“As far as we know, we’re the first ones to get silicon photonics natively integrated into an advanced CMOS process and to achieve energy efficiencies that are very competitive with electronics,” said Mark Wade of the University of Colorado, Boulder, who will present his team’s work at OFC. Wade’s co-authors include researchers from the Massachusetts Institute of Technology and the University of California, Berkeley.
 
Quenching a Thirst for Power
 
Moore’s Law says that the number of transistors that can fit on a chip doubles every two years, resulting in the exponential rise in computing power we have seen over the last few decades. But even as transistors continue to shrink, Moore’s Law may be reaching its limits, due to the fact that the devices are requiring more power to run, which leads to overheating.
 
Such thirst for power is especially problematic for the communication link between a computer’s central processing unit and its memory.
 
“It’s gotten to the point where it takes too much energy and that limits your computational power,” Wade said.
 
A solution to this problem may lie in photonics, which researchers anticipate will be at least 10 times more energy efficient than electronics. Chip-to-chip communication links using these photonic devices could have at least 10 times higher bandwidth density, meaning they can transmit much more information using a smaller amount of space. That’s because different optical signals can share the same optical wire, whereas sending multiple electrical signals either requires multiple electronic wires or schemes that require more chip space and energy.
 
But so far, Wade explains, photonic devices used in chip-to-chip communication have been primarily custom-built using specialized methods, limiting their commercial applicability. And devices that have been created with more standardized techniques rely on older technology, which limits their ability to compete with cutting-edge electronics.
 
On the Road to Commercialization
 
The ability to produce high-performing photonic devices using the CMOS process means chip designers will not have to be specialists to design photonic devices, Wade explained, which will hopefully accelerate the commercialization of photonic technology.
 
“IBM’s CMOS process has already been commercially proven to make high-quality microelectronics products,” Wade said. The work was part of the U.S. Defense Advanced Research Projects Agency’s Photonically Optimized Embedded Microprocessors (POEM) project.
 
The two devices built by the researchers are key components for the communication link between a computer’s central processing unit and its memory. A modulator converts electrical signals into optical signals. A tunable filter can pick out light signals of particular frequencies, allowing it to select a signal from multiple frequencies, each of which carries data. Used in conjunction with a photodetector, the filter converts optical signals to electrical signals.
 
But according to Wade, the significance of this advancement goes beyond this particular application.
 
“This is a really nice first step for silicon photonics to take over some areas of technology where electronics has really dominated and to start building complex electronic/photonic systems that require dense integration,” Wade said.

For more information, visit http://www.ofcconference.org/home/news-and-press/ofc-nfoec-press-releases/a-step-closer-to-a-photonic-future/


Filed Under: M2M (machine to machine)

 

Related Articles Read More >

Part 6: IDE and other software for connectivity and IoT design work
Part 4: Edge computing and gateways proliferate for industrial machinery
Part 3: Trends in Ethernet, PoE, IO-Link, HIPERFACE, and single-cable solutions
Machine Learning for Sensors

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings