TI serves a large number of customers across a wide range of end equipment areas with innovative semiconductor devices – from catalog and custom analog products to wireless and embedded processing products such as digital signal processors (DSPs) and microcontrollers. To maintain leadership quality, reliability and competitiveness across these very diverse product areas, TI relies on a flexible process technology development and semiconductor manufacturing model that leverages both internal and external strengths and capabilities, as well as relationships with multiple leading-edge foundry partners. This model allows TI to deliver differentiated semiconductor solutions based on the most advanced process technologies available – at the right price, performance and volumes our customers require. It also ensures that our customers have a continuity of supply.
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Texas Instruments introduced the first devices in a new family of humidity sensors that provide the industry’s highest reliability and accuracy and the lowest power consumption – along with built-in protection of sensing elements. The HDC3020 and HDC3020-Q1 will allow engineers to create more reliable industrial and automotive systems that withstand potential damage caused by moisture, […][Read More]
Texas Instruments announced new DLP Pico controllers that deliver advanced light control capabilities in smaller form factors for mass-market 3D scanners and 3D printers. DLPC347x controllers offer the micron-to-sub-millimeter resolution typically found in high-performance, industrial-grade applications in a smaller form factor for desktop 3D printers and portable 3D scanners. Developers can pair the new DLPC3470, […][Read More]
An automotive Ethernet physical layer (PHY) transceiver cuts the external component count and board space in half and consumes less power. The DP83TC811S-Q1’s support for serial gigabit media independent interface (SGMII), small packaging and integrated diagnostic features use Ethernet connectivity to bring greater intelligence to space-constrained automotive body electronics, infotainment and cluster, and advanced driver… [Read More]