Honolulu, HI – The latest advancements in microelectronics technology and circuits will be presented by the world’s leading experts as they gather for the 2014 Symposia on VLSI Technology and Circuits, from June 9-12 (Technology) and from June 10-13 (Circuits) in Honolulu, Hawaii. Alternating between Hawaii and Japan each year, the Symposia represent the semiconductor industry’s most significant mid-year conferences for the latest research in many key technology areas.
A single registration fee enables attendees to participate in both symposia and benefit from this unique opportunity for interdisciplinary learning between device technologists and circuit/system designers. The technical programs of both Symposia overlap, with key topics organized into several Joint Focus sessions.
Preceding each Symposium are full-day short courses featuring distinguished international speakers from industry and academia, evening rump sessions spanning a range of thought-provoking issues that face the industry, and a joint banquet to provide an informal atmosphere for the exchange of interdisciplinary ideas. Also preceding the Symposia will be two satellite workshops: IEEE’s Silicon Nanoelectronics Workshop on June 8 & 9; and a workshop on Spintronics on June 9.
“CMOS scaling down to the 10-nm node, implementation of FinFET, FDSOI and quantum well structures, and novel memory technologies highlight the Technology program,” said Klaus Schruefer, Intel Mobile Communications, chair of the 2014 Symposium on VLSI Technology. “In addition, the potential to use silicon photonics as a memory interconnect technology will be demonstrated, along with a novel curved CMOS image sensor.”
“Significant advancements in diverse application areas such as wearable medical electronics, wireless sensor networks, and data-encryption/security circuits are among the highlights of the Circuits program,” said Vivek De, Intel, chair of the 2014 Symposium on VLSI Circuits. “Power management and energy efficient circuits, along with wire-line and optical communication systems, will also be demonstrated.”
Filed Under: M2M (machine to machine)