In this article, we’ll discuss the recent 200+G PAM4 per-lane interconnect developments supported by various consortia, standards bodies, and new product announcements.  The latest 2023 Ethernet Alliance Roadmap shows the demand for 200+G per-lane pluggable modules, connectors, copper, and optical cable products by 2025. Based on their chart below and the interface roadmap, several different lane-count versions […]

Datacenter server processor chips have proven valuable as pluggable and removable devices for the socket connectors mounted to a server’s main PCB board. However, the number of contacts per socket connector has dramatically risen over the last few years. New chips offer 3000 to 5000 or more contact pads per flip chip.  Typically, the socket […]

The world of gigabits began some 25 years ago, with a progression of interface lanes and links — from 100G and 200G to 400G and then 800G using IO standard and proprietary connectors and cables. Believe it or not, gigabit lanes were first used in 1999. Today, we’re entering the terabit phase with interface links […]

The USB Promoter Group recently announced the November release of the USB4 Version 2.0 specification, a significant update to enable up to 80 Gbps of data performance over the USB Type-C cable and connector. The USB Type-C and USB Power Delivery (USB PD) specifications will also be updated to enable this higher level of data […]

Data-center passive DAC external cables have been standardized and interoperable for decades. However, the mating, inside-the-box cables have yet to be fully standardized. In general, inside-the-box IO interface interconnections have been a competitive value point for those OEMs and suppliers that offer quality options. Providing reliable connectors and twin-axial cables configured in an ideal layout […]

Several deep-packet inspection chips and test instrumentation applications are using next-generation speed-rate IO application-specific integrated circuit (ASIC) chips. These chips combine several circuits in one and are customized for a particular use.  This is different than what the current server and switch markets are typically using. These developers are experienced with the 200+ per lane […]

IO Loopbacks connect digital data streams to their source without purposeful processing or modification. This serves as a diagnostic test for a device and other nodes in the network infrastructure. The return signal is compared with the transmitted signal. For several generations of electronic equipment, using a short cable assembly, molded very-high-density cable interconnect (VHDCI), […]

Passive and active direct liquid cooling for modules and chassis immersion implementations are becoming more commonly used to cool high-wattage devices — such as graphics processing units (GPUs) and switch application-specific integrated circuits (ASICs).  This seems to be driving an expanding fluid connector and cable market with higher-volume units as applications now include hyperscaler and […]

CoaXPress (CXP) is a popular, digital-interface standard developed for high-speed transmission of data, videos, and still images. This interface was introduced in 2008 and has been used in industrial automation for years, with advanced machine vision and robotics applications following suit. It has been driven by reliability and simplicity, which includes its cables and connectors. […]

Newer fabric network input/output (I/O) cables and connectors support higher speeds, reduce latency, and support the latest interfaces — including the IEEE-802.3df Ethernet 200G per-lane specification project and modified versions, such as the RoCE and iWARP Ethernet. Other new cable and connector developments are working to include standard InfiniBand XDR 200G and modified versions, such […]

Leslie Langnau, Managing Editor for Design World Magazine talks with Howard Lind, President & CEO of Cicoil, about Cicoil’s new cable configurator on their website that allows you to easily create and order custom cables.