Cinch Connectivity Solutions, a Bel group company, announces the Midwest Microwave SMP terminations. This new series expands product offerings of higher frequency interconnects into the 5G market. The SMP terminations operate up to 18 GHz, support the MIL-STD-348A standard interface, and are built to operate in extreme temperatures. SMP terminations are suitable for use in […]
Twinax cable assemblies for military and commercial aerospace systems
Cinch Connectivity Solutions, a Bel group company, has added new configurations of MIL-STD-1553 twinax cable assemblies, designed for military and commercial aerospace, ground vehicles, weapon systems, and space applications. Cinch is adding a variety of “on-the-shelf” fixed length Trompeter MIL-STD-1553 cable assemblies, ranging from 1 to 10 ft, and available with popular M17/176-0002 twinax cable. […]
Mil/Aero circular connectors are watertight for harsh environments
Cinch Connectivity Solutions, a Bel group company, announces the availability of its Cinch Mil/Aero Circular connectors DMS-TPTM series. The Mil/Aero Circulars DMS-TP connector series is specifically designed to meet industry requirements pertaining to watertight products in harsh environment applications. This series of connectors is waterproof when temporarily immersed up to 300 m, resistant to corrosion, […]
Fibreco S-Lite beam connector Connector is designed for harsh outdoor environments
Cinch Connectivity Solutions, a Bel group company, announces the availability of its Fibreco S-Lite Connector series. The Fibreco S-Lite expanded beam connector is designed as a cost-effective, high-performance and reliable expanded beam solution for use in rugged and harsh environment applications, including outside broadcast, renewable energy and various military applications. Much like the Fibreco J-Lite […]
Stacking connectors accommodate high-density circuits in mezzanine PCBs
Cinch Connectivity Solutions, a Bel group company, announces the commercial availability of its CIN::APSE stacking connector series. These solderless, high density, stacking interconnects are used for board-to-board, flex-to-board and component-to-board applications. CIN::APSE stacking connectors are found in applications where a mezzanine style PCB layout is utilized to reduce space and weight. The CIN::APSE 1.0 mm pitch accommodates high-density […]