At Sensors Expo 2019, Tom Nguyen, CEO of DunAn Sensing, explains innovative packaging for silicon microelectromechanical systems (MEMS) pressure sensor die that does not sacrifice performance. To complement its stable silicon MEMS die, DunAn Sensing is investing in packaging that takes advantage of the stability and adds flexibility without giving up performance in the package. […]
How does sensor packaging adapt for challenging applications?
At the device level, packaging for microelectromechanical (MEMS) sensors is often performed by an outsourced assembly and test (OSAT) company. The sensors could include accelerometers, gyroscopes, magnetometers and microphones as well as pressure, temperature, infrared, biomedical, chemical and gas sensors. The first level of chip packaging formats includes cavity land grid array (LGA), molded cavity […]
How can a core simplify pressure sensing applications?
At Sensors Expo 2018, Gary Winzeler, Vice President of Marketing & Sales for DunAn Sensing discussed the company’s new approach to specifying pressure sensors using a core approach. DunAn introduced their Ceramic Diaphragm Core (CDC) Core pressure transducer and the MEMS DURAsense Core (MDC) at Sensor Expo. Both allow pressure measurements to pumps, valves and […]