Rogers Corporation (NYSE:ROG) announced the latest addition to its RO4000® Series thermoset circuit materials: RO4830™ high-frequency laminates. RO4830 laminates offer 76-to-81-GHz auto radar sensor designers a lower-cost-but-performance-competitive option. Rogers RO4830 laminates have a lower price point and are processed by means of standard epoxy/glass (FR-4) circuit fabrication methods, for lower overall production costs versus PTFE-based…

Rogers Corporation’s Power Electronics Solutions (PES) group has introduced its latest high-performance cooling material, curamik CoolPerformance Plus. curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate…

Power Electronic Tips

Rogers Corporation’s Power Electronics Solutions (PES) group will be showing examples of its latest advances in busbar power management technology at the upcoming APEC 2016 conference and exhibition,…

Power Electronic Tips

Effective today, the High Performance Foams Division of Rogers Corporation (NYSE: ROG) has officially changed its name to Elastomeric Material Solutions to better reflect the growing range of products and capabilities available to meet customer needs. “This name change is the result of productive input and dialogue with customers and employees from around the world,”…

Rogers Corporation (NYSE:ROG) will be showing samples of the Company’s wide range of industry-leading printed-circuit-board (PCB) materials at DesignCon January 28-January 29, 2015 at the Santa Clara Convention Center in Santa Clara, CA. John Coonrod, Senior Market Development Engineer for Rogers Corp. will be participating in a panel discussing, “Isn’t Gbps Design Complex Enough? Now…

Rogers Corporation (NYSE: ROG) (“Rogers” or the “Company”) announced it has signed a definitive agreement to acquire Arlon, LLC, currently owned by Handy & Harman Ltd. (NASDAQ: HNH), for $157 million, subject to closing and post-closing adjustments. The transaction, which is subject to regulatory clearances, is expected to close in the first half of 2015.…

Rogers Corporation (NYSE:ROG) will be showing some of its high-performance electronic printed-circuit-board (PCB) materials and offering advice on optimum ways to use them at the upcoming PCB West Exhibition (http://pcbwest.com), September 10, 2014, at the Santa Clara Convention Center (Santa Clara, CA). At Booth #300, Rogers will display examples of its many circuit materials, including…

Rogers Corporation and representatives of the Company’s Advanced Circuit Materials Division (ACM) will be present at the 2014 IEEE International Microwave Symposium (IMS) June 3-5 to help attendees learn more about Rogers’ wide range of high frequency circuit materials. Rogers Advanced Circuit Materials Division is a global technology leader in the development of high performance…

Rogers Corporation (NYSE:ROG) will be showing samples of the company’s wide range of printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show (DMEDS, www.electroshows.com/delmar) April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Corp. will be at Booth 622 with information and insight on the use…

The RO4000® series circuit materials are for high performance digital and analog circuit designs. These materials include RO4003C™ laminates, with a dielectric loss tangent of 0.0027 at 10 GHz, and RO4350B™ laminates, with a dielectric loss tangent of 0.0037 at 10 GHz. These materials feature a low z-axis coefficient of thermal expansion (CTE) over a…

Rogers Corporation (NYSE: ROG) Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance. COOLSPAN TECA Film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. The adhesive can be used…

Advanced Circuit Materials Division recently introduced improved high frequency materials to address several market needs. The improved RO4700JXR Series antenna grade laminates were designed for use in base station, RFID and other antenna designs and combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss. The specially formulated RO4700JXR…

When space is tight and display performance is critical, PORON SlimGrip foam is an ideal fit.  SlimGrip foam is Rogers’ softest material yet.  With a starting thickness of 0.5mm and the ability to squeeze into gaps less than 0.05mm, no space will go unfilled. In fact, SlimGrip foam requires one-third the force to achieve 0.05mm…

Rogers Corporation Advanced Circuit Materials Division launched next generation RO4360G2 laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOT’s). In 2010, Rogers Corporation launched its product, RO4360 laminate, the first high Dk RF thermoset laminate. Rogers has now launched the next generation, RO4360G2 laminate, with improved thermal reliability that will help fabricators…

Rogers Corporation will highlight several of its high quality printed circuit board (PCB) materials at the upcoming 2013 IEEE International Microwave Symposium (IMS). This event takes place June 4-6 at the Washington State Convention Center in Seattle, WA. Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod,…

Rogers Corporation will highlight several of its advanced printed circuit board (PCB) materials at the upcoming Del Mar Electronics & Design Show. This event is scheduled for May 1-2, 2013 at the Del Mar Fair Grounds in San Diego, CA.  This show will feature electronic components and integrated circuits (ICs), manufacturing products and services, test equipment,…

Rogers Corporation, represented by its High Performance Foams Division (HPF), will be exhibiting its Silfx™ lightweight silicone comfort foam at the upcoming Aircraft Interiors Expo 2013. Aircraft Interiors Expo 2013 is an international event for emerging designs in cabin interiors, in-flight entertainment, connectivity and passenger services. It is scheduled for April 9-11 at the Hamburg…

Rogers Corporation will be showcasing its high performance circuit materials for commercial and military satellite communications (satcom) electronic applications at the upcoming Satellite 2013 Exhibition. The Satellite 2013 Exhibition will take place on March 19-21 at the Walter E. Washington Convention Center, Washington, DC. More than 350 companies will be exhibiting at this major satcom…

Rogers Corporation will be displaying several examples of its high quality printed circuit board (PCB) materials at the upcoming DesignCon® 2013 Expo. This event is scheduled for January 29-30, 2013 at the Santa Clara Convention Center (Santa Clara, CA).  The DesignCon 2013 Expo features practical solutions for semiconductor and electronic design engineers from more than 130…

Rogers Corporation’s (NYSE:ROG) High Performance Foams Division has introduced a new problem-solving material for handheld mobile devices—Condux Plus™ electrically conductive foam. Even in the most complex, compact handheld electronic designs, Condux Plus materials feature excellent electrical conductivity, consistent mechanical properties, and outstanding electromagnetic (EM) shielding capabilities, allowing them to serve as reliable grounding pads for…

Rogers Corporation will be participating in the PCB West 2012 Conference & Exhibition, September 25-27, in both the technical program and the exhibition floor. Visitors to Rogers’ Booth #101 are invited to find out how halogen-free Theta® circuit materials can improve the performance of their high-speed digital circuits. These RoHS-compliant, laminate and prepreg products exhibit…