TE Connectivity will support the Optical Internetworking Forum (OIF) in a multi-vendor demonstration, “OIF Interoperability 2012 – Enabling High-Speed Dynamic Services”, held March 6-8 at the OCF/NFOEC exhibition in Los Angeles, California, OIF booth #713. TE’s participation will include two multi-vendor interoperable demonstrations that highlight the company’s latest STRADA Whisper 40-Gbps backplane connector and soon-to-be-released zQSFP+ pluggable I/O 28-Gbps connector.
The OIF Interoperability 2012 is intended to showcase interoperability of the OIF’s Common Electrical Interface (CEI) 28G Very Short Reach draft implementation agreement that defines chip-to-module electrical interfaces. In addition, the CEI 25G Long Reach implementation agreement for backplane interfaces will also be demonstrated.
“As our industry experiences a relentless demand for faster data rates that run up to 100 Gbps, the need to define interoperable interfaces for these higher bandwidth 4×25 Gbps channels has never been more apparent,” says Nathan Tracy, Business Development Manager, TE. “The OIF Interoperability 2012 is clear evidence that the industry is stepping up to meet this need. TE is pleased to support this event with our next-generation connectivity products.”
As one of ten OIF members, TE will participate in the OIF Interoperability 2012 by first teaming up with two technology-leading companies to illustrate that multiple 4×28 Gbps components can jointly interact to enable highly-integrated, cost-effective 100-Gbps systems, which may be used in switches, servers, routers, etc. This multi-vendor demonstration will show four channels running a PRBS-31 pattern at 25.78 Gbps; the signals will drive a 13 dB insertion loss channel including TE’s 28 Gbps zQSFP+ connector, which offers four lanes of high-speed differential signals with data rates ranging from 28 Gbps up to potentially 40 Gbps. This connector is expected to meet 100-Gbps Ethernet (100 GbE) and 100-Gbps 4X InfiniBand Enhanced Data Rate (EDR) requirements.
TE will also team up with a third company to demonstrate that 100 Gbps (4×25 Gbps) can be realized over conventional backplane architectures – enabling the next-generation of switches and routers to meet industry’s higher data rate needs. This presentation will include a 32nm test chip, integrating 28-Gbps High Speed Serial (HSS) cores, operating over a TE-supplied reference backplane built with Megtron6 material and featuring TE’s STRADA Whisper product – a high-speed 40 Gbps backplane connector designed to exhibit extremely low noise characteristics and improve signal integrity/EMI performance.
TE Connectivity
www.te.com
OIF Interoperability 2012
www.oiforum.com/public/OIF_Interoperability_2012.html
::Design World::
Filed Under: ELECTRONICS • ELECTRICAL