Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

The next graphene?

By atesmeh | August 6, 2014

Share

Three University of California, Riverside engineers are part of team recently awarded a nearly $1.7 million grant from the National Science Foundation to characterize, analyze and synthesize a new class of ultra-thin film materials that could improve the performance of personal electronics, optoelectronic devices and energy conversion systems.

The team is led by Alexander Balandin, University of California Presidential Chair in Electrical and Computer Engineering and founding chair of the materials science and engineering program at UC Riverside’s Bourns College of Engineering. Other members of the team are Roger Lake, a UC Riverside professor, Alexander Khitun, a UC Riverside research professor, and Tina Salguero, an assistant professor at the University of Georgia.

The project targets a new class of materials, termed van der Waals materials, and heterostructures implemented with such materials. The ultra-thin materials may consist of just one atomic plane, which explains the term “two-dimensional” materials. The project will investigate novel electrical, optical, and thermal phenomena in such materials and heterostructures.

The research is expected to produce new material synthesis techniques and enable practical applications of ultra-thin film materials in electronic switches, optical detectors, low-power information processing and direct energy conversion. The novel devices implemented with the ultra-thin films of van der Waals materials have potential for high speed and low energy dissipation.

The interest to two-dimensional materials was stimulated by the success of the ultimate two-dimensional material known as graphene – a single atomic plane of carbon atoms. Graphene research activities resulted in the observation of new interesting physical phenomena and led to numerous proposals of graphene’s practical applications, including improving the performance of everything from smart phone to batteries to tennis rackets.

Electrical and thermal conduction in graphene substantially differs from that in conventional bulk three-dimensional materials. The unusually high thermal conductivity of graphene was discovered at UC Riverside by a group led by Balandin. The exceptional heat conduction property of this two-dimensional material is presently finding its way to practical applications in thermal management.

Each member of the NSF-funded team will cover different aspects of the research and application of the van der Walls materials.

Balandin will conduct materials characterization, fabrication and experimental testing of nanodevices, Lake will perform the first principal theoretical analysis and computer simulation of the properties of new materials and devices. Khitun will design circuits and systems based on two-dimensional materials and atomic heterostructures. Salguero will synthesize new materials using chemical approaches.

Original Release: http://www.eurekalert.org/pub_releases/2014-08/uoc–tng080514.php


Filed Under: Aerospace + defense

 

Related Articles Read More >

Flexible rotary shafts support thrust reverser on 150 LEAP 1-A turbofan engines
Drone-mounted inspection breaks barriers for F-35
TriStar, a misunderstood failure of design
Air Force Jet
How drones are advancing metrology for fighter jets

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings