Lancaster, PA – Thermacore, Inc. announced that it has reached a historic milestone with the company’s celebration of 40 years in business.
Thermacore, Inc. was formed in 1970 for the purpose of transforming heat pipe technology from a laboratory curiosity into a marketable product to enhance standard heat sinks by dramatically improving thermal performance. Since its founding in 1970, Thermacore has produced tens of millions of heat pipes and other thermal management products to provide efficient cooling for military and aerospace electronics, medical equipment, power electronics, computer microprocessors, communications, and other electronic equipment.
In the late 1980’s and early 1990’s, Thermacore led the charge in commercializing heat pipe technology for cooling computer microprocessors. The turning point came when Thermacore’s sintered powder wick technology became the accepted thermal management solution for a new generation of faster, more powerful processors in the mid-1990s, opening up a wealth of applications and making this technology a de facto standard. Because of that development, virtually every heat pipe with a sintered powder metal wick manufactured in the world today can trace its heritage back to early research and product development performed by Thermacore. They continue to hold that leadership position, moving advanced technology to commercialization with the application of vapor chamber heat pipes to commercial and military platforms, the implementation of pumped liquid cooling for computers and the integration of advanced materials to compliment heat pipe heat sinks, taking these technologies to the next level of integration.
“We’re proud to celebrate 40 years as a leader and innovator of thermal management technologies,” said Jerome Toth, Thermacore President and CEO. “It’s a tribute to the dedication and the engineering excellence of Thermacore employees, and is symbolic of the experience and knowledge that we can offer our customers.”
Thermacore, Inc.
www.thermacore.com
::Design World::
Filed Under: Aerospace + defense, Medical-device manufacture, ELECTRONICS • ELECTRICAL