Researchers can now consistently achieve temperature differentials of 55-60º C with miniature embedded thermoelectric component (eTEC) material at room temperature. Nextreme's enhancements to eTEC technology are already getting attention.
With eTEC, the materials are only 5-15 micrometers thick, about 100 times thinner than the typical 1 mm thick pellets used in conventional thermoelectric devices.
“It is remarkable that devices no thicker than a piece of paper can deliver this kind of performance,” said David Koester, VP of Engineering at Nextreme. “This should have an immediate impact in photonics and other industries where a lack of an integrated cooling solution is limiting market penetration of various products.”
Nextreme's eTECs use thin films that are small, fast, efficient, and reliable. They add as little as 100 microns (0.1 mm) of height to a heat spreader or package, which enables unobtrusive integration close to the heat source. The eTEC's millisecond response time rapidly cools or heats to maintain a precise temperature depending on the the application.
A typical device pumps a maximum heat flux of 150 W/cm2 with some designs delivering as much as 400 W/cm2 versus 10-20 W/cm2 for typical bulk TECs.
For more information, or to request eTEC prototype, contact:
Nextreme Thermal Solutions
3040 Cornwallis Road
P. O. Box 13981
Research Triangle Park, NC 27709-3981
Tel: (919) -990-8300
Filed Under: Semiconductor