A Wafer-Level Chip-Scale Package (WLCSP) allows remarkably small packaging dimensions. Bosch Sensortec used WLCSP for its BMM150 triaxial magnetic field sensor and achieved a footprint of only 1.56 x 1.56 mm2 and a height of just 0.6 mm. With a height of only 0.6 mm, the sensor can be placed in the edges of the casing or on stacked PCBs. The small size of the magnetic field sensor with its high effective measurement range of ±1300 µT provides designers a high degree of flexibility in positioning the sensor within the end product’s package.
For more information about Bosch Sensortec’s BMM150 triaxial magnetic field sensor, click here.
Filed Under: Sensor Tips
