Master Bond’s EP21TDCHT-LO two component epoxy adhesive is formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio. Upon curing, the adhesive offers high shear and peel strength which allows it to be used in a number of demanding situations including temperature cycling, as well as high vibration and mechanical shock. It will bond well to most metals, plastics, rubbers, glass and ceramics. This flexibilized system is particularly well suited for bonding dissimilar substrates, especially where the substrates have different coefficients of expansion. EP21TDCHT-LO is a desirable electrical insulator and will resist most chemicals, including water, oils and many organic solvents. The service temperature range is outstanding; from 4°K to +350°F. This versatile system can be used in structural, electronic, aerospace, medical, and OEM, as well as in other applications. EP21TDCHT-LO passes NASA low outgassing specifications.
Filed Under: Industrial automation