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Wireless Network Design Platforms account for building structures, floorplans, and terrain elevations

By Andrew Zistler | March 28, 2016

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remcomEDX Wireless and Remcom announce the integration of SignalPro with Wireless InSite X3D ray-tracing beginning with the release of SignalPro version 8.3.

The X3D model from Remcom uses GPU acceleration to greatly reduce calculation time. The model includes effects from reflections, diffractions, and transmissions and serves a variety of service area environments including urban, indoor and indoor/outdoor. The X3D model is now available as an add-on product from EDX, allowing users to take advantage of these features in SignalPro projects.

By using SignalPro with the X3D model, engineers are able to take into account the three dimensional features of the environment where wireless networks will be deployed, including building structures, floorplans, and terrain elevations. This approach to network modeling shows how signals interact with relevant features in the propagation environment and provides a comprehensive and highly accurate model of site specific network calculations. X3D’s exact path algorithm assures that predictions are accurate, and the GPU acceleration significantly reduces the time to complete predictive simulations.

Remcom
remcom.com

The post Wireless Network Design Platforms account for building structures, floorplans, and terrain elevations appeared first on Analog IC Tips.


Filed Under: Analog IC Tips, Wireless
Tagged With: remcom
 

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