Master Bond

Custom Formulated Adhesives, Sealants and Coatings

With over 35 years of experience, Master Bond is a leading manufacturer of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Master Bond offers over 3,000 grades of specially designed polymer systems, including one and two component epoxies, silicones and UV curable compounds that can be formulated to meet precise application requirements.

Specific grades meet different certifications including:

…and more.

Featured Articles & Products


Special adhesives bring clarity to optic applications

Fiber optic, opto-electronic and photonic applications must have superior transparency, requiring optically clear epoxies, polysulfides, and silicones that exhibit excellent light transmission. Contributed by Rohit Ramnath, Senior Product Engineer, Master Bond Optical transmission, the ability for light to be channeled through a material, is particularly important for fiber optic, opto-electronic and photonic applications. As a [Read More]

Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings and Potting Applications

Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. “It is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance,” said Robert Michaels, vice president of technical support. “Its toughness lessens the chance of stress cracking when thermally [Read More]

One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation

Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two methods to protect chips and their wire bonds. One method is referred to as glob top, where the encapsulating system is dispensed and applied directly to the area to be [Read More]

Additional Resources

Featured White Paper

mb-wp-thumbnail_ultra-low-thermal-resistant-adhesives-electronic-applications_200x260Ultra Low Thermal Resistant Adhesives
For Electronic Applications

As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability.

As product manufacturers face greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are uniquely qualified to meet these increasingly diverse requirements. Learn more about why ultra low thermally conductive adhesives are the preferred fastening approach in applications requiring careful thermal management.