AirBorn, Inc.: a Texas-based designer and manufacturer of innovative, high-reliability electronic manufacturing services, interconnects and value-added solutions for OEMs announces significant enhancements to their innovative HD4™ Interconnect Solution.
HD4™’s already groundbreaking design now incorporates the addition of an “inverted T” termination on the board mount connector for improved PCB assembly. “This design modification reduces overall costs by eliminating potting, while also increasing signal integrity and routing times” explains Atul Sharma, AirBorn’s Senior Director of Signal Integrity Products. HD4™ now garners an IPC-610 class III construction classification; further reinforcing HD4™ as a highly robust solution.
HD4™’s copper cable assembly advancements include the option of solid conductor wire in addition to stranded wire, enabling a longer reach and better signal integrity at a lower cost due to enhanced manufacturing processes. Additional advances include: Improved backshell casing to reduce EMI/EMC even further, improved longer latch for positive engagement and improved strain and bend relief. Additionally, AirBorn’s HD4™ is now UL, CSA & RoHS certified.
“These improvements are a result of AirBorn’s continuous drive to offer leading edge interconnect solutions developed with direct design input from our customers”, explains Robert Kleinschmidt, Senior Vice President of Sales and Marketing at AirBorn.
HD4™’s high bandwidth, high performance, and mission-critical reliability makes it uniquely suited for the most demanding, multi-dimensional network fabrics and ultra-fast storage/SSD cluster applications. It has been designed specifically for next-generation data center and cloud computing platforms.
AirBorn Inc. will exhibit the “New & Improved” HD4™ Interconnect Solution at Super Computing 2015, November 16-19 in Austin Texas. AirBorn is exhibiting in booth 212 and will display HD4™ in actual customer applications. For more information, visit AirBorn’s HD4™ page.
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