In certain applications, it is ineffective or impractical to use hot soldering to form conductive paths. Devcon, a producer of technology and products for OEM assembly and maintenace/repair applications, developed an alternative with its introduction of Syon electrically conductive adhesive solders. These epoxy and epoxide formulations mix and pour easily, fill voids completely, and cure with minimal air entrapment.
Syon Tru-Bond 206A Conductive Adhesive Solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide also suits applications where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding. Pot life is 1 to 3 hours. Cure time is 72 hours at 75° F, or 2 hours at 130° F. Service temperatures are from -65 to 200° F.
Tru-Bond 214 Adhesive is a silver-filled, nonsagging epoxy paste for applications requiring a conductive bond when hot soldering is impractical. It forms conductive paths on circuit boards and prepares electrodes for capacitance and loss measurements. The adhesive is also appropriate for applications requiring high thermal conductivity. Pot life is 1 hour, and cure time is 24 hours at room temperature. Service temperatures are from -65 to 200° F.
Tru-Bond 215 Copper-Filled Epoxy Adhesive is electrically and thermally conductive. This nonsagging paste replaces hot solder in the preparation and repair of conductive paths on circuit boards and in RF shielding, as well as in heat-sink applications. Pot life is 45 minutes, and it cures at room temperature. However, heating the adhesive to 150° F for 2 hours speeds curing and ensures maximum electrical conductivity. Service temperatures are from -65 to 200° F.
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Filed Under: Semiconductor, Materials • advanced