New packaging technologies and materials, especially for fragile components or substrates are challenging semiconductor developers. The The ZAO Force-Controlled Actuator addresses these semiconductor back-end and electronics challenges and helps ensure the integrity of fragile component or target substrates without compromising the machine throughput.
The ZAO Force-Controlled Actuator is suited for semiconductor pick and place, die bonding and probing machines. Coupled with the AccurET controller, the actuator is a state-of-the-art solution to reduce machine cost of ownership.
ZAO is a 30-mm travel actuator with a frictionless bearing arrangement and a light moving mass, ensuring very low and repeatable force application as well as low force overshoot at impact on a contact surface.
The actuator is compatible with the sensorless force-control algorithm, delivering force control accuracy (0.2 N ±10%) with high dynamics capability (up to 20 g).