The SpeedStack mezzanine connector system from Molex (Lisle, IL) provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature:

• A stack height of 4.00mm.
• Support data rates up to 40 Gbps per differential pair. 
• A 0.80mm pitch, with a narrow housing design to minimize obstruction in convection air system cooling. 
• Robust insert-molded wafer design including a protected shrouded housing. 
• A shielding ground pin to improve electrical performance and minimize cross-talk.

For more information, visit www.molex.com