Rogers Corporation (NYSE:ROG) will be exhibiting at the upcoming IPC APEX Expo, scheduled for March 15-17 at the Las Vegas Convention Center (Las Vegas, NV).
On the conference side, John Coonrod, Technical Marketing Manager for Rogers Advanced Connectivity Solutions, and author of the popular ROG Blog series, will present his paper on “High Frequency RF Electrical Performance Effects of Plated through Hole Vias” on March 16th at 10:30 AM.
Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM 3850HT, CLTE-XT, TC350 RO3003 and XT/duroid laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.
ULTRALAM 3850HT high-temperature (HT) liquid-crystal-polymer (LCP) circuit material delivers improved manufacturability in multilayer circuits. Its high melt temperature of +330°C improves multilayer layer-to-layer registration and offers improved thermal stability, while its low effective dielectric constant (3….@10GHz), low loss (0.002), and thin core offerings make it an ideal circuit material for millimeter wave frequencies, including 77 GHz used in long range automotive collision-avoidance radar systems. Being highly impermeable, this material is an attractive alternative to ceramic for MMIC (monolithic microwave integrated circuit) packaging.
CLTE-XT laminates are formulated for use in some of the most demanding phase-sensitive applications in communications, radar and electronic-warfare (EW) circuits and systems. These composite materials are ceramic-filled PTFE based circuit materials with woven fiberglass reinforcement. With eXtended Technology, CLTE-XT laminates maintain a low Dk of 2.94 across wide temperature ranges. CLTE-XT laminates provide excellent dimensional stability, with lower loss than the original CLTE circuit materials.
TC350 laminates are for designers seeking a cost effective high thermal conductivity PTFE material. These materials are designed for applications where high power RF signals demand improved PCB thermal management. With a combination of low loss tangent (0.0020 at 10GHz), high z-axis thermal conductivity (1.0W/m°K), low z-axis CTE (23 ppm/°C), and world class temperature phase stability (-9ppm/°C), TC Series laminates enable improved performance and reliability in high power applications. TC Series materials are ideal for high volume applications with panel sizes available as large as 48”x54”. TC Series materials are often chosen for applications such as power amplifiers and devices such as couplers, combiners, and dividers.
RO3003 laminates are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul communications systems. While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant laminates are available with ½ ounce and 1 ounce rolled copper foil. Combining the very low dielectric loss of the RO3003 PTFE-ceramic resin system with smooth foil, results in high frequency circuit materials with best-in-class insertion loss. Also available with up to 0.040” thick copper plate.
XT/duroid laminates utilize PEEK (polyether ether ketone) based dielectric cores. PEEK is a high melting point polymer (Tm = 343C/649F) with excellent chemical and radiation resistance. This makes XT/duroid copper clad laminates an excellent choice for flex/rigid printed circuit boards that are exposed to harsh environmental conditions (e.g., aeronautics, oil & gas deep hole drilling, etc.) During the Large High Temperature Flexible Printed Circuits Board (LHTFPCB) project, under the European funded Clean Sky program, XT/duroid laminates passed more than 3700 hours at 260C (500F) continuously followed by 2x 8 hours vibration testing at 260°C (500F) without failure. XT/duroid laminates are available in various thicknesses starting at 2mil (50µm), are halogen free and inherently flame retardant. These laminates have very good dielectric strength, very low thermal resistance and provide excellent high frequency performance when utilizing low profile copper foil. Both the dielectric constant and dissipation factor are stable over a wide range of frequencies and temperature.
Rogers Corporation
rogerscorp.com
Filed Under: Materials • advanced
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