Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

Rogers Corporation to Display at IPC Midwest and PCB West Shows

By Patrick Curran | September 8, 2009

Share



Chandler, AZ
– Rogers Corporation (NYSE:ROG) showcases a number of its high-performance and low-cost laminate materials for commercial and military applications at the upcoming PCB West 2009 this September 15-16 in Santa Clara, CA (Booth #36) and at the IPC Midwest 2009 Show this September 23-24 in Schaumburg, IL (Booth #502).

rogers-laminate-materials.jpg


At both shows, Rogers will provide examples of its many innovative printed-circuit laminate materials, including its low-cost RO4730™ LoPro™ antenna-grade material. Benefits of this laminate include a dielectric constant of 3.0, compatibility with conventional FR-4 and high-temperature lead-free solder processing, and a lightweight composition (30% lighter than glass-filled PTFE laminates). Visitors to either show can also learn about Rogers RO3730™ ceramic-filled laminates. These high-performance laminates are engineered for antenna designers as a cost-effective PTFE-based laminate alternative. The RO3730 materials are reinforced by woven glass for excellent electric performance and outstanding structural stability, with low Z-axis coefficient of thermal expansion (CTE) for repeatable plated-through-hole (PTH) fabrication. The RO3730 laminates feature low passive intermodulation (PIM) performance and a dielectric constant of 3.0, making them ideal for use in 3G and 4G cellular base stations.


For applications where high performance is a prime consideration, visitors to both shows can also examine Rogers RT/duroid® 5880LZ laminate materials, with the industry’s lowest available dielectric constant of 1.96 ± 0.04 at 10 GHz. Fabricated with a unique filler material, these light-weight PTFE composites feature low dissipation factor (typically 0.0019 at 10 GHz) and low Z-axis CTE for superior PTH reliability. They exhibit consistent panel-to-panel dielectric constant and are easily cut, sheared, and machined in support of low-cost manufacturing processes.


Finally, Rogers will feature its RO4000® and Theta™ materials. The RO4000 laminates offer uniform dielectric constant across each sheet, with low dissipation losses, low CTE, and excellent dimensional stability. Halogen-free Theta materials offer the low insertion loss and outstanding thermal characteristics needed for superior mechanical and electrical performance in multilayer circuits. With a dielectric constant of 4.01 at 10 GHz and a low dissipation factor, (0.0118 at 10 GHz) the environmentally friendly Theta circuit materials are available in a wide range of laminate and prepreg thickness options.


Rogers Corporation

www.rogerscorp.com


::Design World::


Filed Under: Adhesives • epoxies, Materials • advanced

 

Tell Us What You Think!

Related Articles Read More >

Self-lubricating and wear-resistant: igus bar stock for food, continuous operation and high media resistance
Minnesota Rubber and Plastics announces plans for new Innovation Center
The importance of resin selection
EXE014 - Image 1
Composite materials help place Italian race team in pole position

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Renishaw next-generation FORTiS™ enclosed linear encoders offer enhanced metrology and reliability for machine tools
  • WAGO’s smartDESIGNER Online Provides Seamless Progression for Projects
  • Epoxy Certified for UL 1203 Standard
  • The Importance of Industrial Cable Resistance to Chemicals and Oils
  • Optimize, streamline and increase production capacity with pallet-handling conveyor systems
  • Global supply needs drive increased manufacturing footprint development

Design World Podcasts

June 12, 2022
How to avoid over engineering a part
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings