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TerraWave Wi-Fi Antennas From Ventev Minimize Interference in High-Density Venues

By WDD Staff | April 28, 2014

Ventev Wireless Infrastructure (Hunt Valley, MD), a division of TESSCO Technologies Incorporated [NASDAQ: TESS], has announced three new antenna products to expand the TerraWave portfolio of high-density solutions that address the challenges of Wi-Fi deployments in large venues with many simultaneous users. The two antennas and co-locating mount feature the latest technology to maximize user capacity while minimizing interference. 

As Wi-Fi-capable devices such as smartphones and tablets become more and more prevalent in universities, convention centers, airports, manufacturing facilities and other large venues, network owners must convert their traditional, coverage-oriented Wi-Fi networks to high-density networks with sufficient capacity to support numerous individual client devices. Ventev delivers the solutions to help meet the challenges of providing fast and reliable wireless access.

Minimizing channel interference or “beam bounce” is a critical component of a high-density network and, until now, a frustrating challenge for network administrators trying to maximize capacity. To meet that need, two new High-Density Antennas were developed based on customer feedback and Ventev’s extensive Wi-Fi deployment experience. 

The lower gain of the TerraWave 4 dBi high-density patch antenna limits RF interference making it an ideal solution for facilities with lower ceilings and multi-levels like classrooms and lecture halls, where floor-to-floor interference exists and signal bounce must be minimized. 

With a narrow 55-35 degree beamwidth, the new 6 dBi high-density patch antenna with narrower beamwidth complements the range of 6dBi TerraWave antennas. Boasting the latest advanced technology in high-density antennas, it reduces the number of users per access point (AP), increasing capacity and improving the individual Wi-Fi user experience. 

The other challenge was to simplify installation of the access point and the high-density antenna in challenging environments. The solution here was the co-locating mount. This new, easy-to-install mount allows both the high-density antenna and the AP to be co-located in one décor-friendly unit. The aesthecially pleasing unit conceals equipment and wires, but is rugged enough to be used in tough environments like warehouses and manufacturing plants, or other high-ceiling facilities.  

For more information visit terrawave.com.

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Filed Under: M2M (machine to machine)

 

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