The next generation of RF chips for the wireless and connectivity markets are the RFX2401 and RFX2402. These chips will replace conventional larger, multi-die front-end modules. Leveraging BiCMOS technology, they reduce the complexity of wireless designs, lower manufacturing costs with their small footprint, and use verly little power.
The RFX2401 is an integrated single-chip, single-die Bluetooth/Zigbee RFeIC (RF Front-end Integrated Circuit). Its architecture integrates the PA, LNA, transmit and receive switching circuitry, the associated matching network, and the harmonic filter all in a BiCMOS single-chip, single-die device. It is designed for use in Bluetooth Class-1 and Single-Port Zigbee applications. With an integrated power detect circuit, it requires only one external power supply capacitor and the desired band-pass filter for the TX-RX port.
Filed Under: Semiconductor, Wireless, Electronics • electrical
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