Design World

  • Home
  • Technologies
    • ELECTRONICS • ELECTRICAL
    • Fastening • joining
    • FLUID POWER
    • LINEAR MOTION
    • MOTION CONTROL
    • SENSORS
    • TEST & MEASUREMENT
    • Factory automation
    • Warehouse automation
    • DIGITAL TRANSFORMATION
  • Learn
    • Tech Toolboxes
    • Learning center
    • eBooks • Tech Tips
    • Podcasts
    • Videos
    • Webinars • general engineering
    • Webinars • Automated warehousing
    • Voices
  • LEAP Awards
  • 2025 Leadership
    • 2024 Winners
    • 2023 Winners
    • 2022 Winners
    • 2021 Winners
  • Design Guides
  • Resources
    • Subscribe
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Engineering diversity
    • Trends
  • Supplier Listings
  • Advertise
  • Subscribe

COFES 2019 begins in Silicon Valley — Congress on the future of engineering software

By Mike Santora | April 10, 2019

COFES-LogoThe COFES Institute today welcomes attendees to the opening of the 20th annual Congress on the Future of Engineering Software (COFES). COFES runs from April 7 to 10 and for the first time is being held in Silicon Valley, CA.

Widely recognized as a think-tank event, COFES gathers vendors, users, press and analysts to discuss the most important issues facing both customers and providers of engineering technologies for product and building design. The three-day event provides a relaxed and informal atmosphere designed to foster thoughtful conversation. Industry leaders attend COFES for the informative content delivered by experts, but equally important are the informal discussions and connections that are made.

“COFES is more relevant than ever,” said Pete Wells, COFES Institute Board Chairman. “Product and design complexity is increasing, at an accelerating rate. How the software industry supports designers of products and buildings is central to the mission of COFES. To support our mission, the COFES Institute is led by a Board of Directors and assisted by a Board of Advisors made up of seasoned professionals from the industry,” said Wells.

Celebrating its 20th anniversary, this year’s COFES theme is the convergence of technologies and the implications for software in design and engineering. Convergence is happening quickly. These technologies present tremendous opportunities for the products and buildings of tomorrow. However, design teams are struggling to keep up. Converging technologies such as Additive Manufacturing, Artificial Intelligence, Augmented Reality/Virtual Reality, Generative Design, IoT, Machine Learning and Cloud computing, enable possibilities that were not even imagined before. This is creating a new reality for design teams.

Now operating as a non-profit, the COFES Institute gives special recognition to the sponsors of this year’s event that provided important financial support. Microsoft (Platinum Sponsor); Dell and Facebook (Gold Sponsors); and IpX, Madison Park Group and TechSoft3D (Silver Sponsors).

Microsoft will share insights regarding the possibilities the cloud can bring to companies for competitive advantages when it comes to software solutions for design and manufacturing. “Microsoft is enabling solution providers to build cloud-based solutions for Engineering and Manufacturing,” said Diego Tamburini, Microsoft Principal Industry Lead – Cloud for Engineering and Manufacturing. “COFES 2019 provides a unique opportunity to have conversations with the thought leaders in this solution space which will provide insight to us for building out our cloud-based marketplace for design, manufacturing and AEC,” said Tamburini.

The Dell keynote will be delivered by Curtis Schwebke, Vice President and Software CTO of Dell’s Client Innovation Group. The keynote will focus on new technology from Google (PWA) for developing industrial strength web applications suitable for the COFES audience of design, manufacturing and AEC. “We’re excited to join COFES 2019 and take part in the conversations that will shape the future of the engineering workflow, enabling our technical and scientific communities to change our world for the better,” said Chris Ramirez, Engineering, Manufacturing and AEC strategist, Client Solutions, Dell.

Rounding out the keynotes will be Elizabeth Baron, the principal inventor of the Ford Immersive Vehicle Environment (FiVE) process and technology and founder of Immersionary Enterprises. “Design is a team endeavor. Immersive collaborations allow teams, large or small, to actively participate and contribute. With the immersive approach, it is much easier to engage people with different technology experience, which aligns perfectly with the COFES 2019 theme of convergence,” said Baron.

In addition to the keynotes, COFES 2019 is packed with breakout sessions led by industry experts on topics associated around the theme of technology convergence.

This year, COFES is exploring new areas of focus that could extend beyond the current theme. One consideration is Women in Engineering. There will be a panel discussion led by women who have made an impact in the field. According to the National Science Foundation, overall, women have higher college graduation rates compared to men. However, men disproportionately outnumber women in the number of Science and Engineering (STEM) degrees received. The purpose of the panel is to begin the discussion on how COFES can contribute to bringing diversity into the field.

A new segment added this year is The Game Changers Challenge. This “Shark Tank” style rapid-fire session will feature eight start-ups in the engineering/manufacturing software space, which range from concept to shipping product. Participants will be judged by a panel of experts.

COFES
www.cofesinstitute.org

You Might Also Like


Filed Under: NEWS • PROFILES • EDITORIALS, AI • machine learning, Virtual reality • VR
Tagged With: cofes
 

LEARNING CENTER

Design World Learning Center
“dw
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for Design Engineering Professionals.
Motor University

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Sustainability, Innovation and Safety, Central to Our Approach
  • Why off-highway is the sweet spot for AC electrification technology
  • Looking to 2025: Past Success Guides Future Achievements
  • North American Companies Seek Stronger Ties with Italian OEMs
  • Adapt and Evolve
  • Sustainable Practices for a Sustainable World
View More >>
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Control Engineering
  • Consulting-Specifying Engineer
  • Plant Engineering
  • Engineering White Papers
  • Leap Awards

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • ELECTRONICS • ELECTRICAL
    • Fastening • joining
    • FLUID POWER
    • LINEAR MOTION
    • MOTION CONTROL
    • SENSORS
    • TEST & MEASUREMENT
    • Factory automation
    • Warehouse automation
    • DIGITAL TRANSFORMATION
  • Learn
    • Tech Toolboxes
    • Learning center
    • eBooks • Tech Tips
    • Podcasts
    • Videos
    • Webinars • general engineering
    • Webinars • Automated warehousing
    • Voices
  • LEAP Awards
  • 2025 Leadership
    • 2024 Winners
    • 2023 Winners
    • 2022 Winners
    • 2021 Winners
  • Design Guides
  • Resources
    • Subscribe
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Engineering diversity
    • Trends
  • Supplier Listings
  • Advertise
  • Subscribe
We use cookies to personalize content and ads, to provide social media features, and to analyze our traffic. We share information about your use of our site with our social media, advertising, and analytics partners who may combine it with other information you’ve provided to them or that they’ve collected from your use of their services. You consent to our cookies if you continue to use this website.OkNoRead more