DELO (Windach, Germany) now offers a special heat-curing adhesive that cures to full strength in temperatures as low as 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging applications, where several temperature-sensitive materials are bound together. Technical specifications include:
- 48 hour processing time.
- Storage life: four months at -18°C.
- Can be dispensed through needles with a diameter as small as 200 µm.
For more information, visit www.delo-adhesives.com.
Filed Under: M2M (machine to machine)